JPH0413878B2 - - Google Patents

Info

Publication number
JPH0413878B2
JPH0413878B2 JP60137845A JP13784585A JPH0413878B2 JP H0413878 B2 JPH0413878 B2 JP H0413878B2 JP 60137845 A JP60137845 A JP 60137845A JP 13784585 A JP13784585 A JP 13784585A JP H0413878 B2 JPH0413878 B2 JP H0413878B2
Authority
JP
Japan
Prior art keywords
insulating layer
wiring
thick film
conductor
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60137845A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61296798A (ja
Inventor
Kakuzo Morigami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP13784585A priority Critical patent/JPS61296798A/ja
Publication of JPS61296798A publication Critical patent/JPS61296798A/ja
Publication of JPH0413878B2 publication Critical patent/JPH0413878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP13784585A 1985-06-26 1985-06-26 厚膜印刷配線基板の製造方法 Granted JPS61296798A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13784585A JPS61296798A (ja) 1985-06-26 1985-06-26 厚膜印刷配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13784585A JPS61296798A (ja) 1985-06-26 1985-06-26 厚膜印刷配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61296798A JPS61296798A (ja) 1986-12-27
JPH0413878B2 true JPH0413878B2 (en]) 1992-03-11

Family

ID=15208155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13784585A Granted JPS61296798A (ja) 1985-06-26 1985-06-26 厚膜印刷配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61296798A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258202A (ja) * 2009-04-24 2010-11-11 Renesas Electronics Corp 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025173U (ja) * 1983-07-28 1985-02-20 株式会社東芝 厚膜回路

Also Published As

Publication number Publication date
JPS61296798A (ja) 1986-12-27

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